Piana Cross Lapping Technology
Piana Cross Lapping Technology transforms single layer or dual carded layers of web into multiple stacked layers through
lapping process to create a nonwoven with wide range of thickness and basis weight for various applications.
Piana Cross Lapping Technology delivers uniform and top quality profile across the length and width of product at
high production speed.
Piana Cross Lapping Technology utilizes high performance treated fibers patented by Piana Group to provide unique,
inexpensive, and efficient solutions for flame retardant and antimicrobial applications.
Technical features
Capabilities
Natural and synthetic blends can be used in the process
Wide range of denier from 1 to 15; wide range of thickness 2-50 mm; wide range of basis weight
Scrim lamination for delicate cross lap
Recyclable fibers can be used in the process
Light weight nonwoven pad
Flame retardant barrier and custom chemical functionality
Anti-microbial nonwoven pad
Sound barrier nonwoven pad
Temperature Management